Whether you need a basic single layer circuit board delivered tomorrow, or a complex 30-layer mil-spec PCB using exotic metals, Runrays can provide an instant quote and manufacture your boards in as fast as 24 hours.

  • Manufactured in China
  • On-site inventory of the finest materials, up to 30 layers
  • 1-day turn-times available
  • Build with the highest quality PCBs
  • Board thickness: .005″ – .250″
  • Max panel size: 21″ x 29″
  • Min trace and space: .002″
  • Solder mask feature tolerance: .001″
  • Blind and buried vias
  • IPC 6012, class 1, 2 and 3

Board parameters for rigid PCBs

 STANDARDADVANCEDMICRO
Min Layer Count111
Max Layer Count303030
Min Board Thickness.010” (.254 mm).005” (.127 mm).005” (.127 mm)
Max Board Thickness.250” (6.35 mm).250” (6.35 mm).250” (6.35 mm)
Min Core Thickness.004” (.102 mm).002” (.051 mm).002” (.051 mm)
Min Dielectric.004” (.102 mm).003” (.076 mm).002″ (.051 mm)
Min Starting Copper Foil Weight9 microns9 microns5 micron
Max Finished Copper Thickness (O/L)4 oz (118 ml)6 oz (177 ml)1 oz (30 ml)
Max Finished Copper Thickness (I/L)4 oz (118 ml)4 oz (118 ml)0.5 oz (15 ml)
Min Panel Size12” x 18” (30 x 46 cm)12” x 18” (30 x 46 cm)12″ x 18″ (30 x 46 cm)
Max Panel Size12” x 18” (30 x 46 cm)21” x 29” (53 x 74 cm)18″ x 24″ (46 x 61 cm)
Smallest Mechanical Drill Diameter.0059” (.150 mm).0059” (.150 mm).0059″ (.150 mm)
Smallest Laser Drill Diameter.005″ (.127 mm).004″ (.102 mm).004″ (.102 mm)
Min Finished Hole Size.004” (.102 mm).002” (.051 mm).002″ (.051 mm)
Max Through Hole Aspect Ratio (depending on board thickness and finish hole)10:110:1> 10:1
Max Laser Via Aspect Ratio.75:1.75:1.75:1
Blind Via Finished Hole Size.004” (.102 mm)Plated ShutPlated shut
Buried Via Finished Hole Size.004” (.102 mm).002” (.051 mm).002″ (.051 mm)
Min Trace and Space.004” (.102 mm).003” (.076 mm).002″ (.051 mm)
Min Pad Size for Test.005” (.127 mm).005” (.127 mm).005″ (.127 mm)
Process Pad DiameterD + .012” (.305 mm)
(1-mil (.025-mm) annular ring)		D + .008” (.203 mm) (tangency)D + .008” (.203 mm) (tangency)
Stacked ViasYesYesYes
Min Wire Bond Pad Size> .006” (.152 mm).004” (.102 mm).004″ (.102 mm)
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002” (.051 mm).001” (.025 mm).001″ (.025 mm)
Solder Mask Feature Tolerance.0015” (.038 mm).001” (.025 mm).001” (.025 mm)
Solder Mask Min Dam Size (based on green soldermask color).005” (.127 mm).004” (.102 mm).004″ (.102 mm)
Min Diameter Route Cutter Available.024” (.610 mm).021” (.533 mm).021″ (.533 mm)
Routed Part Size Tolerance.005” (.127 mm).003” (.076 mm).003″ (.076 mm)
Laser Hole Location Tolerance.0005” (.013 mm).0005” (.013 mm).0005″ (.013 mm)
Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick).002” (.051 mm).002” (.051 mm).001″ (.025 mm)
Bow and Twist TolerancePer IPC specPer IPC specPer IPC spec
Thickness Tolerance (based on board thickness)10%5%5%
Sequential Laminations3 or less lamination cycles4 lamination cycles5 lamination cycles
Buried ViasYesYesYes
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes – Cu plate shut
Non Conductive Filled ViasYesYesYes

Surface finish parameters for rigid PCBs

 STANDARDADVANCEDMICRO
HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
Immersion SilverYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes

Mechanical parameters for rigid PCBs

 STANDARDADVANCEDMICRO
Routed ArrayYesYesYes
V Score, Edge to Copper.01”.007” (.178 mm).007″ (.178 mm)
V Score Angles35°, 45°, 60°35°, 45°, 60°35°, 45°, 60°
CountersinkYesYesYes
CounterboreYesYesYes
BevelYesYesYes
Milling+/- .003” (.076 mm)+/- .002” (.051 mm)+/- .001” (.025 mm)
Edge CastellationYesYesYes
Edge PlatingYesYesYes
HeatsinksNoYesNo

Electrical testing for rigid PCBs

 STANDARDADVANCEDMICRO
10 VoltYesYesYes
40 Volt (Burn-In Boards)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesYes

Our manufacturing process has been optimized over three decades of operations, bringing us to the cusp of systems, processes, and human capital that delivers value with every manufacturing run. Today, we are the preferred partners across the electronics manufacturing spectrum in the China. With our state-of-the-art facilities in both countries, we deliver accurate and high-quality bare boards, quick turnaround prototypes, production volume boards, and flush circuits.

Relentless focus on quality, performance, and resilience are at the core of our manufacturing operations. Our talented team is equipped with tested technology systems to ensure an integrated and streamlined electronics manufacturing process under one roof. We offer accelerated lead times to take customer designs to the manufacturing process with direct access to base materials. We have systematically structured a manufacturing platform that is agile enough to support non-standard base materials, allowing you greater room for customization.