What are Aluminum PCB?
Aluminum PCBs (Printed Circuit Boards) are PCBs that have a metal core, usually made of aluminum, instead of the traditional FR4 (Fiberglass Reinforced Epoxy) material. The metal core provides better thermal conductivity, allowing for more efficient heat dissipation. This makes Aluminum PCBs ideal for high-power applications such as LED lighting, power electronics, and automotive applications.
Advantages of Aluminum PCBs
Environmentally Friendly
Aluminum is a highly recyclable material, and it’s non-toxic. Hence, using the metal for production promotes energy conservation thanks to its ease of assembly. So, when PCB suppliers use aluminum, it preserves environmental health.
Efficient Heat Dissipation
Aluminum Core PCBs have an aluminum core which provides excellent thermal conductivity. This allows for efficient heat dissipation, making them ideal for high-power LED lighting, automotive lighting, and power electronics.
High Durability
Aluminum is a durable material, making Aluminum Core PCBs highly resistant to wear and tear. They can withstand harsh environments, making them suitable for applications that require high reliability and durability.
Cost-effective
Despite their advanced properties, Aluminum Core PCBs are cost-effective and can be produced at a lower cost than other advanced PCB materials.
Specification of Aluminum Based Copper -Clad Laminate
| Part Number | RR-01-B10 | RR-01-B15 | RR-01-B30 | CS-AL-88-AD2 | GL12, GL22 |
|---|---|---|---|---|---|
| Vendor | BOYU | BOYU | BOYU | CSEM | GDM |
| Thermal Conductivity (W/m·k) | 1.0 | 1.5 | 3.0 | 2.0 | 1.0 < λ≤1.5 |
| Peel Strength (Lb/in) | ≥8 | ≥8 | ≥8 | >9 | ≥6 |
| Breakdown Voltage (AC/KV) | 5.0 | 5.0 | 4.0 for 75um dielectric thickness 4.5 for 100um dielectric thickness 6.0 for 125um dielectric thickness | >3 | ≥2 |
| Tg (°C) | 110 | 110 | 150 | 100 | AABUS |
| Td (°C) | 380 | 380 | 380 | 410 | AABUS |
| Dk (@1MHz) | 4.8 | 4.8 | 4.8 | 5.6 | AABUS |
| Df (@1MHz) | ≤0.02 | ≤0.02 | ≤0.02 | 0.013 | AABUS |
| MOT | 130°C | 130°C | 130°C | 130°C | – |
Ability in Process Technology
| Feature | Capability |
|---|---|
| Material | Aluminum core (Domestic 1060), Copper core, FR4 covering |
| Thermal Conductivity | 1.0W/(m⋅K) 1.5W/(m⋅K) 2.0W/(m⋅K) 3.0W/(m⋅K) |
| Min. Track/Spacing | 4mil |
| Min. Hole Size | 1layer（0.8mm) 2layers (0.2mm) |
| Board Thickness | 0.4-3.2mm |
| Surface Finishing | Immersion gold, OSP, Hard gold, Immersion silver, ENEPIG |
| Finsih Copper | 1-4oz |
| Feature | Capability |
|---|---|
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte black, Matte green |
| Silkscreen | White, Black |
| Via Process | Tenting Vias, Plugged Vias, Vias not covered |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |
| Build Time | 2-3 days |
| Lead Time | 3-4 days |
